<% if Session("username")="" then response.redirect("Login.htm") end if %> SAMPADA 2008 - 2nd International Symposium on Advanced Materials And Polymers For Aerospace And Defense Applications




 

 
FINANCIAL ASSISTANCE FORM
 

FINANCIAL ASSISTANCE:

In the interest of promotion of significant global science and technology R&D idea exchange amongst the Foreign and Indian students, PhD research scholars, postdoctoral fellows, young budding chemists, scientists and engineers (working at various academic and research institutions as well as in the aerospace and defense industries), and their one-to-one highly spirited interactions with the seasoned and experienced materials and polymers research scientists, aerospace engineers and academicians, the SAMPADA-2008 Organizing Committees enthusiastically encourages their proactive participations at the conference. Please Register early.

SAMPADA-2008 Organizing Committee is considering to provide financial support in form of ‘partial wavier of Registration Fee’ under the limited Financial Assistance Program, on a first come first served basis.

Student and young scientist/engineer applicants requesting financial assistance must submit this FINANCIAL ASSISTANCE FORM along with separate letters of recommendation from their supervisors and heads of departments (on the organization’s official letterhead/stationery), respectively.

Since the level of funding to be made available for the program is not determined yet, therefore, please contact your region’s contact person for further information, only after July 15th, 2008.

SPECIAL FEATURE:

In addition, the SAMPADA-2008 organizing committee is considering to host a Job Fair on Wednesday, December 10th, from 10 AM to 4 PM for fresh graduates as well as experienced professionals (scientist, chemist and engineers) who are looking for industrial and academic R&D jobs. The event will be held subject to favorable response from prospective employers. If you are interested, fill up and submit separate forms to register as a Candidate for the Job Fair, as well. For further information Please contact your region’s contact person, only after July 31st, 2008.
 

 

Exhibitor / Advertiser Information

(Please fill in all the applicable information in the appropriate section. Please use BLOCK LETTERS)

Date:(MM/DD/2008)

// 2008
 

Nationality of Applicant:

FOREIGNER* INDIAN**

Title

MR.MS.DR    

 Name:

 

(First or Given Name)

(Middle Initial)

(Last or Family Name)

Current Status:

Student   Research Scholar  Professional/Young - Chemists / Scientists / Engineer's

Organization Affiliation:

Official Designation:

Department:  

Field of Study:

Degree Pursued:

ID Number:

Home Address:

Country:

City:

Zip / Pin:

Organization Address:

Country:

City:

Zip / Pin:

Phone:

(+ (Country code) – (Local area code) – Ph No.)

Mobile:

(+ (Country code) –Mobile ph No.)

Official E-mail ID:

Personal E-mail ID:

#PASSPORT Number:

#PASSPORT Issuing Country:

Expiry Date:

// 2008 (MM/DD/2008)    

Applicant’s Signature:

     

Applicant’s Supervisor must provide personal information in this Form Supervisor’s Personal Information (Please use BLOCK LETTERS)

Title

MR.MS.DRPROF    

Name:

 

(First or Given Name)

(Middle Initial)

(Last or Family Name)

Office Title:

Department:

Organization Affiliation:

Official Designation:

Organization Address:

Country:

City:

Zip / Pin:

Fax:

(+ (Country code) – (Local area code) – Ph No.)

Phone:

(+ (Country code) – (Local area code) – Ph No.)

Mobile:

(+ (Country code) –Mobile ph No.)

Official E-mail ID:

Personal E-mail ID:

Supervisor’s Signature:

     
       

Liability / Disclaimer:

The Organizers of SAMPADA-2008 shall not be held responsible for personal accidents, illness, losses or damage to private property of registered delegates/organizations. Delegates/Organizations are advised to arrange for their personal insurance for the duration of the conference and personal travel itinerary and tours. Whilst every attempt will be made to ensure that all aspects of the conference mentioned in this announcement will take place as scheduled, the Organizing Committees reserves the right to make last minute changes or cancellation should the need arise without prior notice.
 

IMPORTANT NOTE:

Please Mail/Airmail fully filled and signed this FINANCIAL ASSISTANCE FORM, and Letters of Recommendation by the
Registered Mail (with the Return Receipt requested) from your local Post Office to:
 
Attn.: The Convener
SAMPADA-2008 Conference
Department of Physics,
University of Pune,
Pune- 411007 (Maharashtra)
INDIA.
   

For information or clarification, please contact your region’s contact person:
 

Americas and Europe 

Asia-Pacific

India and Rest of the World

Dr. Rohitkumar H. VORA
Advanced Polymer Research & Technologies
8080, Heritage Drive,
Alburtis, PA 18011

USA
Phone: +1 (732) 331 9913
Fax: +1 (732) 494 3882

E-mail:
rohitvora@apr-technologies.com
            vora_rohit@yahoo.com

Prof. M. P. SRINIVASAN
Department of Chemical & Biomolecular Engineering, Faculty of Engineering, National University of Singapore(NUS)4, Engineering Drive 4 Singapore 117576
SINGAPORE
Phone: + (65) 6516 2171
Fax: +(65) 6779 1936
E-mail:
srinivasan.mp@nus.edu.sg


 

Dr. Dinesh P. AMALNERKAR
Center for Materials for Electronic Technology (CMET), Panchwati,
Off Pashan Road (Near NCL),
Pune 411008 (Maharashtra),

INDIA
Phone: + 91-20 - 2589 8141
Fax: + 91-20 - 2589 8085

E-mail:
amalnerkar@cmet.gov.in

 


 

 

In Association with Organizations & Sponsors,